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ANSYS Coupled-Field Analysis Guide ANSYS Release 10.0 002184 August 2005 ANSYS, Inc. and ANSYS Europe, Ltd. are UL registered ISO 9001:2000 Companies. ANSYS Coupled-Field Analysis Guide ANSYS Release 10.0 ANSYS, Inc. Southpointe 275 Technology Drive Canonsburg, PA 15317 ansysinfo@ansys.com http://www.ansys.com (T) 724-746-3304 (F) 724-514-9494 Copyright and Trademark Information ` 2005 SAS IP, Inc. All rights reserved. Unauthorized use, distribution or duplication is prohibited. ANSYS, ANSYS Workbench, CFX, AUTODYN, and any and all ANSYS, Inc. product and service names are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries located in the United States or other countries. ICEM CFD is a trademark licensed by ANSYS, Inc. All other trademarks or registered trademarks are the property of their respective owners. Disclaimer Notice THIS ANSYS SOFTWARE PRODUCT AND PROGRAM DOCUMENTATION INCLUDE TRADE SECRETS AND ARE CONFIDENTIAL AND PROPRIETARY PRODUCTS OF ANSYS, INC., ITS SUBSIDIARIES, OR LICENSORS. The software products and documentation are furnished by ANSYS, Inc., its subsidiaries, or affiliates under a software license agreement that contains provisions concerning non-disclosure, copying, length and nature of use, compliance with exporting laws, warranties, disclaimers, limitations of liability, and remedies, and other provisions. The software products and documentation may be used, disclosed, transferred, or copied only in accordance with the terms and conditions of that software license agreement. ANSYS, Inc. and ANSYS Europe, Ltd. are UL registered ISO 9001:2000 Companies. U.S. GOVERNMENT RIGHTS For U.S. Government users, except as specifically granted by the ANSYS, Inc. software license agreement, the use, duplication, or disclosure by the United States Government is subject to restrictions stated in the ANSYS, Inc. software license agreement and FAR 12.212 (for non-DOD licenses). Third-Party Software See the online documentation in the product help files for the complete Legal Notice for ANSYS proprietary software and third-party software. The ANSYS third-party software information is also available via download from the Customer Portal on the ANSYS web page. If you are unable to access the third-party legal notices, please contact ANSYS, Inc. Published in the U.S.A. Table of Contents 1. Coupled-Field Analyses....................................................................................................................... 1–1 1.1. Types of Coupled-Field Analysis.................................................................................................... 1–1 1.1.1. Sequential Method.............................................................................................................. 1–2 1.1.1.1. Sequentially Coupled Analysis - Physics Files................................................................ 1–2 1.1.1.2. Sequential Coupled Analysis - ANSYS Multi-field solver................................................ 1–2 1.1.1.3. Sequentially Coupled Analysis - Unidirectional ANSYS to CFX Load Transfer.................. 1–2 1.1.2. Direct Method...................................................................................................................... 1–3 1.1.3. When to Use Direct vs. Sequential........................................................................................ 1–3 1.1.4. Miscellaneous Analysis Methods........................................................................................... 1–3 1.1.4.1. Reduced Order Modeling............................................................................................. 1–3 1.1.4.2. Coupled Physics Circuit Simulation.............................................................................. 1–3 1.2. System of Units............................................................................................................................. 1–3 1.3. About GUI Paths and Command Syntax......................................................................................... 1–8 2. Sequentially Coupled Physics Analysis............................................................................................... 2–1 2.1. What Is a Physics Environment?..................................................................................................... 2–2 2.2. General Analysis Procedures......................................................................................................... 2–2 2.3. Transferring Loads Between Physics.............................................................................................. 2–5 2.3.1. Compatible Element Types................................................................................................... 2–5 2.3.2. Types of Results Files You May Use....................................................................................... 2–7 2.3.3. Transient Fluid-Structural Analyses....................................................................................... 2–7 2.4. Performing a Sequentially Coupled Physics Analysis with Physics Environments............................ 2–8 2.4.1. Mesh Updating.................................................................................................................... 2–9 2.4.2. Restarting an Analysis Using a Physics Environment Approach............................................ 2–12 2.5. Example Thermal-Stress Analysis Using the Indirect Method........................................................ 2–12 2.5.1. The Problem Described...................................................................................................... 2–12 2.6. Example Thermal-Stress Analysis Using Physics Environments..................................................... 2–14 2.7. Example Fluid-Structural Analysis Using Physics Environments.................................................... 2–17 2.7.1. The Problem Described...................................................................................................... 2–17 2.7.2. The Procedure.................................................................................................................... 2–17 2.7.2.1. Build the Model......................................................................................................... 2–18 2.7.2.2. Create Fluid Physics Environment.............................................................................. 2–18 2.7.2.3. Create Structural Physics Environment....................................................................... 2–20 2.7.2.4. Fluid/Structure Solution Loop.................................................................................... 2–21 2.7.3. Results............................................................................................................................... 2–22 2.8. Example Induction-heating Analysis Using Physics Environments................................................ 2–28 2.8.1. The Problem Described...................................................................................................... 2–28 2.8.2. The Procedure.................................................................................................................... 2–28 2.8.2.1. Step 1: Develop Attribute Relationship....................................................................... 2–29 2.8.2.2. Step2: Build the Model............................................................................................... 2–30 2.8.2.3. Step 3: Create Electromagnetic Physics Environment.................................................. 2–30 2.8.2.4. Step 4: Create Thermal Physics Environment.............................................................. 2–30 2.8.2.5. Step 5: Write Thermal Physics Environment................................................................ 2–31 2.8.2.6. Step 6: Prepare DO Loop............................................................................................ 2–31 2.8.2.7. Step 7: Repeat Prior Step............................................................................................ 2–32 2.8.2.8. Step 8: Postprocess Results........................................................................................ 2–32 2.8.2.9. Command Input Listing............................................................................................. 2–32 2.8.2.10. Results.................................................................................................................... 2–34 3. The ANSYS Multi-field (TM) Solver - MFS Single-Code Coupling........................................................ 3–1 3.1. The ANSYS Multi-field solver and Solution Algorithm..................................................................... 3–2 3.1.1. Load Transfer....................................................................................................................... 3–2 ANSYS Coupled-Field Analysis Guide . 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